R&D issues in scale-up and manufacturing of amorphous silicon tandem modules

Autor: R. R. Arya, G. Ganguly, M. Bennett, F. Willing, G. Lin, D. E. Carlson, L. F. Chen, R. Middya, F. Jackson, J. Newton, G. Wood, M. He
Rok vydání: 1999
Předmět:
Zdroj: AIP Conference Proceedings.
DOI: 10.1063/1.57954
Popis: R & D on amorphous silicon based tandem junction devices has improved the throughtput, the material utilization, and the performance of devices on commercial tin oxide coated glass. The tandem junction technology has been scaled-up to produce 8.6 Ft2 monolithically integrated modules in manufacturing at the TF1 plant. Optimization of performance and stability of these modules is ongoing.
Databáze: OpenAIRE