Heterogeneous Integration for High Frequency RF Applications
| Autor: | A. Gutierrez-Aitken |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Reliability (semiconductor)
Computer science Interface (computing) 0202 electrical engineering electronic engineering information engineering Electronic engineering Interposer Key (cryptography) Task analysis 02 engineering and technology Technology development 5G 020202 computer hardware & architecture |
| Zdroj: | 2020 IEEE International Electron Devices Meeting (IEDM). |
| Popis: | Heterogeneous integration (HI) has become a key technology development and production effort in the past few years. HI for RF has become an important task for applications such as 5G in the commercial world and for many higher frequency applications in space and defense. Several factors need to be considered to select a suitable approach, including active semiconductor technologies, performance, materials for interposers, the HI method and interface, cost, yield, and last but not least the overall reliability of the integration. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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