Optics to the Chip: Enabling Standard IC Packaging using Modular Optical Components

Autor:	Robert Varano, David R. Rolston
Rok vydání:	2007
Předmět:	Optics Optical testing business.industry Computer science Volume (computing) Systems design Integrated circuit packaging Modular design business Chip
Zdroj:	Frontiers in Optics 2007/Laser Science XXIII/Organic Materials and Devices for Displays and Energy Conversion.
DOI:	10.1364/fio.2007.fmc5
Popis:	An IC packaging technology that integrates parallel optical sub-assemblies will be described for next generation computing and switching applications. Design and assembly methods for low-cost and volume production are demonstrated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::62deb25d95a71a501126c077bb7bf233 https://doi.org/10.1364/fio.2007.fmc5 Zobrazit plný text záznamu