Crack detection in single-crystalline silicon wafers using impact testing

Autor:	D. Hess, Sergei S. Ostapenko, W. Dallas, C. Hilmersson
Rok vydání:	2008
Předmět:	Impact testing Range (particle radiation) Materials science Acoustics and Ultrasonics Acoustics law.invention Amplitude Quality (physics) law Normal mode Solar cell Electronic engineering Wafer Crystalline silicon
Zdroj:	Applied Acoustics. 69:755-760
ISSN:	0003-682X
DOI:	10.1016/j.apacoust.2007.03.002
Popis:	This paper presents acoustic measurements obtained by mechanically exciting vibratory modes in single-crystalline silicon wafers with hairline periphery cracks of different type and location. The data presented shows a dependence of natural frequencies, peak amplitudes and damping levels of four audio vibration modes in the frequency range up to 1000 Hz on crack type and crack location. Data from defective wafers exhibit lower natural frequencies, higher damping levels, and lower peak amplitudes. The results suggest an impact test method may be useful for solar cell crack detection and quality control.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::62c9343ed288e3c253c79ab20fe992a2 https://doi.org/10.1016/j.apacoust.2007.03.002 Zobrazit plný text záznamu Full Text from ScienceDirect