| Autor: |
Su-Mei Chen, Yu-Min Lin, Huan-Chun Fu, Yung Jean Lu, Chia-Wen Fan, Jen-Chun Wang, C. W. Chiang, Wei-Chung Lo, Yuan-Chang Lee, Ching-Kuan Lee, Chau-Jie Zhan, Wen-Wei Shen, Su-Ching Chung |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| Popis: |
In this paper, we investigated the assembly characterization for reliability test. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, glass thinning and backside RDL formation, were developed and integrated to perform well. The BT substrate design and PCB for electrical characterization of reliability tests are included as well. The results indicate that the device with the glass interposer can be integrated and there is also data showing the feasibility of the glass interposer for electronics applications. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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