The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits
| Autor: | D.J. Schwab, T.M. Schaefer, B.A. Randall, Barry K. Gilbert, Zabinski Patrick J |
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| Rok vydání: | 2002 |
| Předmět: |
Digital electronics
Interconnection Engineering business.industry Circuit design X band Electrical engineering Electronic packaging Printed circuit board Electronic engineering Integrated circuit packaging Hardware_ARITHMETICANDLOGICSTRUCTURES Electrical and Electronic Engineering business Electronic circuit |
| Zdroj: | IEEE Transactions on Advanced Packaging. 25:79-91 |
| ISSN: | 1521-3323 |
| DOI: | 10.1109/tadvp.2002.1017689 |
| Popis: | An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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