The Formation Of Cu Nanofilm By Electrochemical ALD
| Autor: | Youn-Geun Kim, John L. Stickney, Jay Y. Kim |
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| Rok vydání: | 2007 |
| Předmět: | |
| Zdroj: | ECS Transactions. 2:329-335 |
| ISSN: | 1938-6737 1938-5862 |
| DOI: | 10.1149/1.2408886 |
| Popis: | A Au(111) single crystal, cleaned by Ar ion bombardment and annealed in a UHV chamber, was used as a substrate for studies of Cu deposition by electrochemical ALD. The first Cu atomic layer was deposited at an underpotential, by UPD, of 0.050 V versus Ag/AgCl on an I modified Au(111) substrate. The subsequent layers were formed using the redox replacement of Pb UPD with Cu in what is referred to as a surface limited redox replacement (SLRR). Two potentials for Pb UPD were investigated, -0.400 V and -0.440 V, with each deposit lasting 2 minutes. Subsequent immersion in the Cu2+ solution was for 10 second, at open circuit. The resulting Cu thin films were analyzed using Auger electron spectroscopy and low energy electron diffraction (LEED). As a final step, total Cu coverages were determined for the resulting nanofilms by anodic stripping, and Cu replacement efficiencies were determined. |
| Databáze: | OpenAIRE |
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