Stress analysis of CMOS-MEMS microphone under shock loading by Taguchi method

Autor: Chun-Lin Lu, Meng-Kao Yeh, Pei-Rong Ni
Rok vydání: 2018
Předmět:
Zdroj: Microelectronics Reliability. :824-828
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2018.06.110
Popis: The stress distribution and failure of CMOS-MEMS microphone under shock loading was investigated by finite element method in this study. The results show that corners of spring, the anchors connecting spring and fix end and the connection of the spring and diaphragm had higher stresses for MEMS microphone under shock loading. Four parameters, the width of anchor, the width of spring, the radius of diaphragm and the thickness of diaphragm, were chosen in stress analysis of MEMS microphone by Taguchi method. Each parameter has lower, middle and higher levels. The case with higher width of anchor, width of spring, thickness of diaphragm and lower radius of diaphragm has smaller stress, 35% less than that of the original design; the case with middle width of anchor, lower width of spring, higher radius of diaphragm and thickness of diaphragm has 7.3 times of microphone capacitive sensitivity than that in the original design. Drop test experiment was performed to verify the simulation results according to the JEDEC standards, JESD22-B111 and JESD22-B110B. The results obtained in this study can give useful suggestions for improving the design and robustness of MEMS microphone.
Databáze: OpenAIRE