Laser Drilling Technique for Multilayer Ceramic Chip Component and Module
| Autor: | Naoto Narita, Mutsuo Nakazawa, Masayuki Fujimoto, Hiroshi Takahashi, Shoichi Sekiguchi |
|---|---|
| Rok vydání: | 2000 |
| Předmět: |
Materials science
business.industry General Chemistry Integrated circuit Condensed Matter Physics Laser law.invention Surface micromachining Machining law visual_art Materials Chemistry Ceramics and Composites visual_art.visual_art_medium Optoelectronics Laser power scaling Ceramic business Laser drilling Electronic circuit |
| Zdroj: | Journal of the Ceramic Society of Japan. 108:807-812 |
| ISSN: | 1882-1022 0914-5400 |
| DOI: | 10.2109/jcersj.108.1261_807 |
| Popis: | High-speed laser drilling using low laser power and flexible circuit layout changes was applied to form 3-dimensional circuits in multilayer ceramics to fabricate miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials enabled ultra-fine through-holes to be formed in thin ceramic green sheets without damaging supporting plastic film where ceramic slurry was cast. Drilling basically involved thermal ablation |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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