Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

Autor:	Xinrui Ji, Henk Van Zeijl, Joost Romijn, Hendrik Joost Van Ginkel, Xu Liu, Guoqi Zhang
Rok vydání:	2022
Zdroj:	2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
DOI:	10.1109/estc55720.2022.9939417
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::61e1c401b84ed4df4700338fc3254191 https://doi.org/10.1109/estc55720.2022.9939417 Zobrazit plný text záznamu