Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

Autor: K-D. Lang, M. Schneider Ramelow, J. Bickel, Ha-Duong Ngo
Rok vydání: 2019
Předmět:
Zdroj: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
DOI: 10.23919/empc44848.2019.8951872
Popis: Three-dimensional printing and rapid prototyping are becoming more and more important in the field of research and low volume production. There are many systems that can print a wide variety of materials. In the field of thin-film technology, as required for MEMS applications, only a few approaches are available. One of the promising technologies in this field is sputtering at atmospheric pressure with miniaturized plasma sources. This paper introduces a new anode nozzle geometry that increases the productivity of this novel technology substantial. It shows that three-dimensional thin-film metal structures can be printed more economically.
Databáze: OpenAIRE