Integrated Test for Silicon Front Ends
| Autor: | Benjamin Laemmle, Dietmar Kissinger, Robert Weigel, Linus Maurer |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Test strategy
Engineering Radiation Traceability business.industry Condensed Matter Physics Variety (cybernetics) Domain (software engineering) Hardware_INTEGRATEDCIRCUITS Electronic engineering System on a chip Radio frequency Electrical and Electronic Engineering Transceiver business Electronic circuit |
| Zdroj: | IEEE Microwave Magazine. 11:87-94 |
| ISSN: | 1527-3342 |
| DOI: | 10.1109/mmm.2010.936076 |
| Popis: | Silicon-based technologies have enabled the monolithic integration of transceiver circuits with operational frequencies up into the millimeter-wave regime. While high integration relaxes the requirements on RF chip-to-chip interconnects and external circuitry, it imposes serious challenges upon the traceability of failure mechanisms and functional errors of the individual building blocks that comprise the front-end. Additionally, expensive external measurement equipment in combination with complex, error-prone, and time-consuming calibration procedures, necessitates the development of on-chip test modules. It has been shown that a variety of built-in test schemes are currently the topic of research for both the mixed-signal and microwave domain. Solutions for the individual building blocks that will enable direct verification of performance parameters have been presented throughout this article. Current RF transceiver architectures will require a mixture of both paradigms for successful implementation of integrated test strategies. It is the authors' belief that the application of such concepts is a must for future integrated transceiver systems to meet the stringent requirements of time-to-market and low-cost of mass market consumer products. |
| Databáze: | OpenAIRE |
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