Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions**
| Autor: | Rajeshuni Ramesham, Amarit Kitiyakara, Richard Redick, Eric T. Sunada |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Engineering
Computer Networks and Communications business.industry Coaxial cable Electrical engineering Mechanical engineering chemistry.chemical_element Temperature cycling Electronic Optical and Magnetic Materials law.invention Reliability (semiconductor) chemistry law Aluminium Thermal Braid Resistance thermometer Electrical and Electronic Engineering Aerospace business |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 7:67-72 |
| ISSN: | 1551-4897 |
| Popis: | A process has been explored based on the state-of-the-art technology to bond the platinum resistance thermometer (PRT) on to potential aerospace material such as a flat aluminum surface and a flexible copper tube to simulate coaxial cable for the flight applications. Primarily, PRTs were inserted into a metal plated copper braid to avoid stresses on the sensor while attaching the sensor with braid to the base material for long duration deep space missions. Appropriate pretreatment has been implemented in this study to enhance the adhesion of the PRTs to the base material. NuSil product has been chosen in this research to attach PRT to the base materials. The resistance (approx.1.1 k(Omega)) of PRTs has been electrically monitored continuously during the qualification thermal cycling testing from -150 C to +120 C and -100 C to -35 C. The test hardware has been thermal cycled three times the mission life per JPL design principles for JUNO project. No PRT failures were observed during and after the PRT thermal cycling qualification test for extreme temperature environments. However, there were some failures associated with staking of the PRT pig tails as a result of thermal cycling qualification test. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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