Impacts of UV cure for reliable porous PECVD SiOC integration [IC interconnect applications]

Autor:	T. Kimura, A. Fukazawa, S. Kondo, K. Yoneda, Nobuyoshi Kobayashi, N. Matsuki, Kiyohiro Matsushita, N. Ohara, M. Kato
Rok vydání:	2005
Předmět:	Materials science Fabrication business.industry Oxide chemistry.chemical_compound Chemical bond chemistry Plasma-enhanced chemical vapor deposition Optoelectronics Irradiation Porosity Porous medium business Curing (chemistry)
Zdroj:	Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..
Popis:	An ultra violet (UV) cure was investigated to improve the mechanical and electrical properties of porous carbon-doped PECVD (plasma enhanced chemical vapor deposition) oxide film (k
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::60a8214e20a15347e15be90074c9d3e3 https://doi.org/10.1109/iitc.2005.1499989 Zobrazit plný text záznamu