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For die to wafer bonding of high-density interconnects and fine pitch microbumps developing and characterizing suitable underfill materials are required. In general, underfill serve to fill the spaces in-between microbumps for protection and reliability. Among the different types of underfill, Non-Conductive Film (NCF) has the advantages of fillet and volume control, and a built-in flux to aid wetting. However, challenges arise for thin dies and microbumps with fine pitches on film lamination, voiding, transparency, filler percentage, dicing compatibility and most importantly, deformation behavior and possibility to improve solder joint wetting. In a Die-to-Wafer D2W stacking with a Sn solder bump interconnect to Cu UBM, concern is high on the Cu pad oxidation due to the repeated TCB cycles that accelerate oxidation on neighboring dies. Process mitigation is needed to help reducing the oxidation. But even so, an NCF must have good embedded flux activation. Another main factor for an NCF to have efficient TCB process with good solder joint wetting, is the NCF deformation quality in which is a function of its viscosity. This parameter has direct impact on the deformation of solder bumps. High viscosity NCF would be difficult to deform, thus preventing solder contact to pad during TCB reflow temperature. High bond force is required and could lead to reduced alignment accuracy. Filler entrapment is also a subsequent concern for high filler loading, high viscosity NCF. For a low viscous NCF, careful attention in process characterization is needed in TCB with low bond force. Solder joint wetting is a problem with excessive squeeze-out due to fast and instantaneous deformation. With low viscosity, not only the bond force applied should be low, but the deformation behavior should also be understood to enable an effective NCF. We seek to demonstrate in this paper a creative methodology for Non-Conductive Film (NCF) material characterization, considering the factors of NCF viscosity, deformation, and solder squeeze-out. Characterizing NCF viscosity at fast TCB profiles is challenging considering deformation behavior of both the NCF itself and the solder bumps that shaped the solder squeeze-out and wetting. Furthermore, in this paper we use TCB tool position tracking to define the deformation curve of NCF film as a function of temperature and time at very fast profile of TCB. We use material viscosity curve as reference in relation to the actual deformation, and predict dynamic deformation based on Reynold’s equation within TCB profile duration. The experiments were performed with different heating ramp rates at target above Sn reflow of ~250C interface temperature. The deformation analysis is not limited to thin film sandwiched between parallel plates. Deformation test was performed on chips with and without microbumps and with rigid flat glass surface and its combinations. Deformation of underfill is recorded in the readout of TCB tool. As validation, we applied the optimized TCB process (force, temperature, and ramp rate) on a test vehicle with 20 and 40um pitch daisy chains and obtained close to 95% electrical yield with good joint and IMC formation. The cross-section SEM images show good wetting, revealing good activation of built-in flux when the optimized TCB profile was used. |
