A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects

Autor:	Bo Sun, Yaoyang Shen, Zhihao Zhang, Chunbing Guo, Chengqiang Cui
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Safety Risk Reliability and Quality Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronics Reliability. 142:114904
ISSN:	0026-2714
DOI:	10.1016/j.microrel.2023.114904
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6012197a3ccd2e23fd6d34556ac38fc2 https://doi.org/10.1016/j.microrel.2023.114904 Zobrazit plný text záznamu Full Text from ScienceDirect