Comprehensive Quality and Reliability Management for Automotive Product
| Autor: | W.S. Chiang, M. Z. Lin, M. J. Lin, Harry Chen, M. H. Hsieh |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Computer science business.industry Signoff media_common.quotation_subject Automotive industry Guard band Code coverage 01 natural sciences Automotive electronics Reliability engineering Process variation Reliability (semiconductor) 0103 physical sciences Quality (business) business media_common |
| Zdroj: | IRPS |
| DOI: | 10.1109/irps45951.2020.9128795 |
| Popis: | In this paper, we demonstrated a robust design, test and screen methodology to achieve the high quality and reliability demand for automotive products. In design phase, a comprehensive aging signoff flow is proposed. By thorough consideration of device aging behavior, thermal distribution and process variation, design for reliability can be implemented through the well control of aging margin. The product with aging signoff has 75mV improvement in end-of-life guard band. To meet automotive product DPPM expectation, two approaches are exercised for DPPM reduction. 1) System-level test (SLT) is introduced for improving test coverage. By exercising the IC of a system as an integrated whole for its intended end-use application, the marginal defects which escapes from function test (FT) can be detected. Result shows over 100 DPPM could be screened out. 2) An early failure rate (EFR) estimation strategy by 3 steps dynamic voltage stress (DVS) is proposed. It enables screen condition determination for achieving DPPM target. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|