Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
| Autor: | Mario Sprenger, Niklas Noll, Christoph Hecht, Malte de Greiff, Lars Muller, Jorg Franke |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
| Databáze: | OpenAIRE |
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