Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages
| Autor: | Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Takashi Imoto, Hiroshi Nishikawa |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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