| Autor: |
Ajit P. Paranjpe, Rhett B. Jucha, Steven A. Henck, Maureen A. Hanratty |
| Rok vydání: |
1992 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
The diffusion enhanced silylated resist or DESIRER process is a well known surface imaging lithographic technique consisting of three steps: exposure, silylation, and dry develop. The success of this method for patterning submicron features depends critically on controlling silicon incorporation in the resist. In this report interferometric data obtained during the resist silylation step and subsequent dry develop etch have been used to correlate silylation parameters and exposure dose with the depth of silicon incorporation. Contrast and linewidth variation as a function of silylation depth have been derived. A kinetics model in conjunction with image intensity simulations has been used to understand the effects of process parameters on pattern quality. The potential of using the interferometric data for process monitoring is also discussed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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