Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

Autor:	A. Salahouelhadj, M. Gonzalez, A. Podpod, E. Beyne
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00268
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5f6308d4fa2df5fbcdbb20c04dd9cd01 https://doi.org/10.1109/ectc51906.2022.00268 Zobrazit plný text záznamu