Trends and issues in Pb-free soldering for electronic packaging

Autor:	D. R. Frear
Rok vydání:	2001
Předmět:	Thermal copper pillar bump Materials science Soldering Alloy Metallurgy engineering Electronic packaging Electrical and Electronic Engineering engineering.material Alloy composition Microstructure Flip chip Eutectic system
Zdroj:	e & i Elektrotechnik und Informationstechnik. 118:81-86
ISSN:	1613-7620 0932-383X
DOI:	10.1007/bf03157756
Popis:	A variety of Pb-free solder alloys have been proposed for use as interconnects for electronic packaging including Sn−Ag, Sn−Cu, Sn−Ag−Cu, Sn−Ag−Bi, and Sn−Sb, among others. This paper presents a review of the behavior of promising Pb-free solder alloys as related to their microstructure. Recommendations of optimal alloy composition as a function of performance requirements are given. For surface mount applications, eutectic Sn−Ag−Cu is recommended as the optimal alloy. For flip chip interconnects, the eutectic Sn-Cu alloy has the best performance. The materials and process trends of Pb-free packaging are summarized with optimal conditions identified.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5f60e30bccf9cce0fd1650583a0d0729 https://doi.org/10.1007/bf03157756 Zobrazit plný text záznamu Full text from SpringerLink