Joining of silicon nitride via a transient liquid
| Autor: | Giacomo Ceccone, M. Paulasto, S.D. Peteves |
|---|---|
| Rok vydání: | 1997 |
| Předmět: |
Materials science
Adhesive bonding Mechanical Engineering Metallurgy Metals and Alloys Direct bonding Condensed Matter Physics chemistry.chemical_compound Flexural strength Silicon nitride chemistry Mechanics of Materials visual_art visual_art.visual_art_medium Brazing General Materials Science Wetting Ceramic Composite material Diffusion bonding |
| Zdroj: | Scripta Materialia. 36:1167-1173 |
| ISSN: | 1359-6462 |
| DOI: | 10.1016/s1359-6462(97)00007-9 |
| Popis: | The widely used direct bonding methods for ceramic materials, reactive metal brazing and solid-state diffusion bonding, have limitations, in particular the former route when used to produce Si{sub 3}N{sub 4} joints able to withstand high operation temperatures. An alternative method proposed of creating high temperature resistant interfaces between dissimilar materials is partial transient liquid phase (PTLP) bonding. In the present study silicon nitride was joined to silicon nitride using multilayer inserts CuTi/Pd/CuTi and Ti/Cu/Ti. The ability of these combinations to form a transient liquid during joining and therefore their applicability for PTLP-bonding of Si{sub 3}N{sub 4} was studied. Flexural strengths of joints were determined at room temperature and at elevated temperatures up to 800 C. The joint microstructures and fracture surfaces were examined optically and with SEM/EDX/EPMA techniques. |
| Databáze: | OpenAIRE |
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