Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment
| Autor: | Glenn M. Beheim, Gary W. Hunter, Philip G. Neudeck, David J. Spry, Roger D. Meredith, Dorothy Lukco, Kyle G. Phillips, Leah M. Nakley, Liang-Yu Chen |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
Computer Networks and Communications Venus 02 engineering and technology Integrated circuit 01 natural sciences law.invention Atmosphere chemistry.chemical_compound law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Silicon carbide Electrical performance Ceramic Electrical and Electronic Engineering 010302 applied physics biology 020208 electrical & electronic engineering Metallurgy biology.organism_classification Electronic Optical and Magnetic Materials chemistry visual_art visual_art.visual_art_medium Earth (classical element) |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 16:78-83 |
| ISSN: | 1551-4897 |
| Popis: | This article presents experimental results of a prototype high-temperature cofired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with a 60-d demonstration in a simulated Venus surface environment consisting of a 465°C corrosive atmosphere at 90 bar pressure. The prototype package is based on a previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide high-temperature semiconductor integrated circuits in 500°C Earth air ambient for more than 10,000 hours, and short-term tested at temperatures above 800°C. The three-phase harsh environment test started with 48 h in 465°C Earth air, followed by 48 h in 465°C nitrogen at 90 bar pressure and 1,400 h in a simulated Venus surface environment of 465°C corrosive atmosphere at 90 bar. In addition to in situ electrical tests in a three-phase harsh environment and posttest electrical diagnosis, initial posttest analysis of the package materials and surfaces was performed to assess the stability of the packaging materials in the testing environments, as well as the surface conditions after the test. The test in the simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig. The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help improve the long-term electrical performance of an HTCC alumina packaging system in a Venus environment. |
| Databáze: | OpenAIRE |
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