| Autor: |
Jon Wu, Christophe Fouquet, Guo-Tsai Huang, T. S. Gau, Henk-Jan H. Smilde, Stephen P. Morgan, Maurits van der Schaar, Y. C. Ku, Cathy Wang, Miranda Un, Murat Bozkurt, Andreas Fuchs, Kai-Hsiung Chen, Steffen Meyer, Vincent Tsai, Kaustuve Bhattacharyya, Martin Jacobus Johan Jak, Peter Ten Berge, Michael Kubis, L. G. Terng, Mark van Schijndel, David Hwang, Chih-Ming Ke, Arie Jeffrey Den Boef, Frida Liang, Kevin Cheng |
| Rok vydání: |
2013 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
Aggressive on-product overlay requirements in advanced nodes are setting a superior challenge for the semiconductor industry. This forces the industry to look beyond the traditional way-of-working and invest in several new technologies. Integrated metrology2, in-chip overlay control, advanced sampling and process correction-mechanism (using the highest order of correction possible with scanner interface today), are a few of such technologies considered in this publication. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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