| Autor: |
Corey Dunsky, Edward C. Rea, Tom M. Corboline |
| Rok vydání: |
2003 |
| Předmět: |
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| Zdroj: |
Fourth International Symposium on Laser Precision Microfabrication. |
| ISSN: |
0277-786X |
| DOI: |
10.1117/12.540931 |
| Popis: |
As the demand for semiconductor devices based upon ever-thinner silicon substrates continues to increase, mechanical techniques suitable for dicing wafers appear to be approaching their practical limits. Recent advances in power scaling have now enabled reliable ultraviolet-wavelength lasers to be considered to offer a flexible solution to this dilemma. This paper presents new data on the machining of thin silicon wavers using a high average power 355-nm wavelength pulsed laser. In particular, the concept of pulse repetition-rate scaling of the effective cutting speeds was investigated to determine the preferred direction for further laser development efforts. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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