| Autor: |
Jong-Bong Kim, Won-Sang Seo |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
Soldering & Surface Mount Technology. 25:145-154 |
| ISSN: |
0954-0911 |
| DOI: |
10.1108/ssmt-oct-2012-0022 |
| Popis: |
Purpose – The purpose of this paper is to suggest an analysis methodology for the stencil printing process and to obtain proper design parameters that guarantee the successful filling using suggested finite element analyses.Design/methodology/approach – Filling performance of solder paste in the stencil printing process is highly dependent on material properties such as viscosity and surface tension together with process parameters such as squeegee angle and squeegee speed. In order to investigate the effects of process parameters on the filling performance, the pressure built‐up under the squeegee and the filling procedure of the solder paste into an aperture were analysed. Due to the limitations of the computational memory and time, the analysis domain was simplified. The pressure development under the squeegee was investigated for various values of squeegee angle and speed; then, the filling behaviour with the pressure boundary condition was analysed for only one aperture. Finally, the two analysis res... |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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