Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

Autor:	Junli Feng, Weiou Qin, Shiwei Jiang, Jidong Li, Yongzhong Zhan, Qiang Zhang, Wenchao Yang
Rok vydání:	2021
Předmět:	Materials science Metallurgy Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Solder alloy
Zdroj:	Journal of Materials Science: Materials in Electronics. 33:177-189
ISSN:	1573-482X 0957-4522
DOI:	10.1007/s10854-021-07283-6
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5da972140b3f5f71e5ff668dafd19554 https://doi.org/10.1007/s10854-021-07283-6 Zobrazit plný text záznamu Full text from SpringerLink