Evaluation of Cu-AlN Joint Brazed with In-Based Active Brazing Filler Metals
| Autor: | Hideki Sasaoka, Toshikatsu Miki |
|---|---|
| Rok vydání: | 2001 |
| Předmět: |
Filler (packaging)
Materials science Mechanical Engineering Metallurgy chemistry.chemical_element Nitride Condensed Matter Physics Copper Metal chemistry Flexural strength Mechanics of Materials Aluminium visual_art visual_art.visual_art_medium Brazing General Materials Science Ceramic Composite material |
| Zdroj: | Journal of the Society of Materials Science, Japan. 50:194-199 |
| ISSN: | 1880-7488 0514-5163 |
| DOI: | 10.2472/jsms.50.9appendix_194 |
| Popis: | The In-Ti active fillers were examined for joining metallic copper (Cu) to aluminum nitride (AlN) ceramics. Brazing was carried out with In-Ti active brazing filler metals with various compositions, and the microscopic structure and mechanical strength of the Cu-filler-AlN-filler-Cu joint at various temperatures were investigated. When brazed with an In-rich filler of In-1wt%Ti, most of In atoms in the filler were diffused into the Cu plate leaving a Ti-rich reaction layer of 2-4μm thick at the Cu-AlN joint interface. The 4-point bending strength at 500°C increases linearly with the brazing temperature, whereas the strength at room temperature saturates at 40MPa. The specimen brazed at 820°C has the strength of 58MPa and 33MPa at 500°C and 600°C, respectively. On the other hand, when using Ti-rich fillers, e.g., In-7.7wt%Ti, In-15wt%Ti and In-23.8wt%Ti (the same as Ti3In4 composition), granular Ti-rich phases were formed at the interface, and the microcracks were observed in the AlN. |
| Databáze: | OpenAIRE |
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