Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Autor:	Soo-Bok Chin, Byoung-Ho Lee, Do-Hyun Cho, Chang-Lyong Song, Jin-Seo Choi
Rok vydání:	2007
Předmět:	Materials science business.industry fungi education technology industry and agriculture macromolecular substances Semiconductor device Repeatability Signal stomatognathic diseases Semiconductor Si substrate Optoelectronics Wafer business Throughput (business) Lithography
Zdroj:	SPIE Proceedings.
ISSN:	0277-786X
DOI:	10.1117/12.710746
Popis:	As the design rules of semiconductor devices have decreased, the detection of critical killer defect has became more important. One of killer defect is under-etch defect caused by insufficient contact etch. Although very low throughput only e-beam inspection tool has used for monitoring tools of under-etch defect because optic wafer inspection does not have enough defect signal to detect that on a contact layer. In this study, a new method is suggested for detection of under-etch defect using optic wafer inspection tools which have high throughput and repeatability.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5d51c95dd9b709a8293769a7c5b957e4 https://doi.org/10.1117/12.710746 Zobrazit plný text záznamu