Analysis of Through Silicon Vias and substrate coupling in 3D CMOS circuits by Spice simulations

Autor:	Mohamed el Amine Benkechkache, Saida Latreche, Lamis Ghoualmi
Rok vydání:	2021
Zdroj:	2021 International Conference on Engineering and Emerging Technologies (ICEET).
DOI:	10.1109/iceet53442.2021.9659679
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5ccc1398aff7d7dc7f5bc148c95868cd https://doi.org/10.1109/iceet53442.2021.9659679 Zobrazit plný text záznamu