Application of Real-Time Cu Thickness Profile Control in Cu CMP

Autor:	Runtao Zhao, Oliver Huang, Hanson Gao, Weifeng Zhang, Zhize Zhu, Changxing Tan
Rok vydání:	2012
Předmět:	Materials science Composite material
Zdroj:	ECS Transactions. 44:553-557
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3694368
Popis:	In this paper, a real-time profile control (RTPC) system in Cu CMP is introduced. The system mainly contains two parts: 1). Real-time metal thickness monitoring based on electromagnetic induction of eddy current in conductive metal layer; 2). Real-time new polishing pressure computing and adjusting for desired metal thickness profile. The RTPC system has been applied in bulk Cu removal step of Cu CMP. The result showed that the Cu thickness profile after bulk Cu removal was flatter and its WIW uniformity was improved by greater than 35% while WTW uniformity could be improved by greater than 65%.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5c870cdd9aa4ba3b00acbb53ed9b4853 https://doi.org/10.1149/1.3694368 Zobrazit plný text záznamu