Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface
| Autor: | Jingjing Zhang, Tongxiang Fan, Di Zhang, Yue Liu, Fan Zhang, Hongdi Zhang |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering Material properties of diamond Metals and Alloys Diamond Cleavage (crystal) 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Carbide Amorphous carbon Mechanics of Materials 0103 physical sciences engineering General Materials Science Statistical analysis Composite material 0210 nano-technology Diffusion bonding |
| Zdroj: | Scripta Materialia. 152:84-88 |
| ISSN: | 1359-6462 |
| DOI: | 10.1016/j.scriptamat.2018.04.021 |
| Popis: | Interfacial debonding is detrimental for the properties of diamond/Cu composites, which can be solved by diamond surface metallization with active element Cr. Using microstructure characterization and statistical investigation, we find that the diamond surface metallization undergoes dispersed growth, preferred growth, complete metallization and preferred cleavage. The preferred carbide growth on {100} surfaces and preferred carbide cleavage on {111} surfaces result from the different surface configurations. Furthermore, an amorphous carbon layer generates at diamond (111)/carbide interface for the structure transformation. Interfacial bonding between diamond and Cu is realized via reaction bonding at diamond/carbide interface and diffusion bonding at carbide/Cu interface. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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