| Autor: |
Duncan Paul Hand, Marc P.Y. Desmulliez, B.G. Moffat, Andrew C. Walker, J.H.-G. Ng, Aongus McCarthy, Marco Lamponi, Kevin Alan Prior, H. Suyal |
| Rok vydání: |
2008 |
| Předmět: |
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| Zdroj: |
2008 2nd Electronics Systemintegration Technology Conference. |
| Popis: |
Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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