Pixel-Level Assessment Model of Contamination Conditions of Composite Insulators Based on Hyperspectral Imaging Technology and a Semi-Supervised Ladder Network

Autor:	Yixuan Kong, Yunpeng Liu, Jianghai Geng, Zhicheng Huang
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering
Zdroj:	IEEE Transactions on Dielectrics and Electrical Insulation. 30:326-335
ISSN:	1558-4135 1070-9878
DOI:	10.1109/tdei.2022.3226164
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5bea541f5a4294204daf791fdfb2e9ef https://doi.org/10.1109/tdei.2022.3226164 Zobrazit plný text záznamu