4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits
| Autor: | Tsuyoshi Fujita, Yutaka Akiba, Masao Mitani, Susumu Kasukabe, Kazuo Hirota, Hironobu Okino, Akio Fujiwara |
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| Rok vydání: | 1991 |
| Předmět: |
Materials science
business.industry Hardware_PERFORMANCEANDRELIABILITY Semiconductor device Substrate (printing) Integrated circuit Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Reliability (semiconductor) law Electrode Hardware_INTEGRATEDCIRCUITS Electronic engineering Optoelectronics Head (vessel) Electrical and Electronic Engineering Safety Risk Reliability and Quality business Electrical conductor Layer (electronics) |
| Zdroj: | Microelectronics Reliability. 31:xiii |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/0026-2714(91)90287-h |
| Popis: | A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability. |
| Databáze: | OpenAIRE |
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