A multi-chip directly mounted 512-MEMS-mirror array module with a hermetically sealed package for large optical cross-connects

Autor:	Hiromitsu Soneda, Norinao Kouma, Hisao Okuda, Ippei Sawaki, Osamu Tsuboi, Xiaoyu Mi, Satoshi Ueda, Yoshihiro Mizuno
Rok vydání:	2006
Předmět:	Microelectromechanical systems Fabrication Optics business.industry Computer science Digital cross connect system Port (circuit theory) Wafer Photonics business Chip Atomic and Molecular Physics and Optics Voltage
Zdroj:	Journal of Optics A: Pure and Applied Optics. 8:S341-S346
ISSN:	1741-3567 1464-4258
DOI:	10.1088/1464-4258/8/7/s08
Popis:	This paper describes the design, fabrication and performance of a 512-MEMS-mirror array module with a hermetically sealed package for large optical cross-connects. This configuration enables a ? 5? rotation of the two-axis stationary operation under a drive voltage of 160?V, with a high resonant frequency of 2?kHz. The 512-MEMS-mirror array module was constructed using newly developed multi-chip direct mounting (MCDM) technology, which allowed us to use small scale mirror array chips and greatly simplifies the fabrication process. The MCDM technology was demonstrated to be especially well suited to building large port count mirror array modules without the size limitation involved with handling wafers. The 512-MEMS-mirror array module measures a compact 122?mm ? 60?mm.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5bd61fd6f0dca459ade98be46f55f195 https://doi.org/10.1088/1464-4258/8/7/s08 Zobrazit plný text záznamu