Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints
| Autor: | Zongxiang Yao, Jiang Shan, Limeng Yin, Diying Ling, Zhongwen Zhang, Zhang Liping |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Scanning electron microscope Intermetallic 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Electronic Optical and Magnetic Materials Brittleness Coating Soldering 0103 physical sciences Ultimate tensile strength Materials Chemistry engineering Electrical and Electronic Engineering Composite material 0210 nano-technology Joint (geology) |
| Zdroj: | Journal of Electronic Materials. 49:5391-5398 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-020-08273-w |
| Popis: | In order to discuss the effects of Cu-cored solder with pure Ni coating and joint height on the interfacial microstructure and mechanical properties of joints, Cu/Sn-3.0Ag0.5Cu (SAC305)/Cu and Cu/Cu-cored + SAC305/Cu sandwich solder joints were prepared using a reflow process. The interfacial microstructure of the solder joints was investigated by scanning electron microscope with energy-dispersive x-ray spectroscopy. The results showed that, at as-reflowed joints, an intermetallic compound (IMC) of scallop-like Cu6Sn5 was formed at the Cu wire/solder interface, and a plane-like (Cux, &!nbsp;Ni1−x)6Sn5 IMC was formed at the Cu core/solder interface. Compared with SAC305 solder joints, Cu-cored solder joints showed more interface layers, a thicker Cu6Sn5 IMC layer, and higher tensile strength. With increasing joint height, the thickness of the IMC at the two interfaces decreased, and the tensile strength also decreased for Cu-cored solder joints. Mixed brittle/ductile fracture appeared in SAC305 and Cu-cored solder joints with height of 600 μm, but were suppressed and transformed into ductile fractures with increasing height of the solder joints. |
| Databáze: | OpenAIRE |
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