| Autor: |
Paul W. Coteus, George Anthony Sai-Halasz, David A. Webber, C.W. Surovic, G.V. Kopcsay, George A. Katopis, Howard H. Smith, Allan H. Dansky, Alina Deutsch, Wiren D. Becker |
| Rok vydání: |
2002 |
| Předmět: |
|
| Zdroj: |
IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370). |
| DOI: |
10.1109/epep.1998.733744 |
| Popis: |
An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C vs. RLC vs. RC representations are valid. Examples are also given of realistic short and long coupled-section interactions and the effect of in-plane neighbouring connections is discussed. Signal propagation and crosstalk are analyzed over the temperature range -160/spl deg/C to +100/spl deg/C and it is shown that Al(Cu) wiring can sustain 4.44 GHz processor frequency at T=+25/spl deg/C operation. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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