Understanding the Contact Mechanism of FS Silver Paste: from Pb-Containing to Pb-Free Pastes
| Autor: | Laudisio, G., Getty, R., Coultart, G., Li, Z., Torardi, T., Lynch Jr., P., Young, R.J.S. |
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| Jazyk: | angličtina |
| Rok vydání: | 2010 |
| Předmět: | |
| DOI: | 10.4229/25theupvsec2010-2cv.3.29 |
| Popis: | 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion, 6-10 September 2010, Valencia, Spain; 2168-2170 Thick film metallizations for solar cells enable high efficiency by etching the SiNx ARC layer and achieving low contact resistance between the Ag electrodes and the emitter. The etching and contacting mechanism is realized through an oxidation reaction between the frit in the metallization and the SiNx. Most of the commercially available pastes in the market use lead-containing frits to achieve high performance with current emitters. However recent directives aiming to reduce hazardous substances restrict the amount of Pb to 0.1wt%. This work shows that lead-free pastes contact the emitter through the formation of a percolation layer of Ag colloids as previously demonstrated for lead-containing pastes. Electrical results are presented to support this finding showing that lead-free pastes can be competitive with lead-containing ones in achieving low contact resistance and high efficiency. |
| Databáze: | OpenAIRE |
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