From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Autor:	Jun-Han Han, Xinfei Guo, Kevin Skadron, Mircea R. Stan
Rok vydání:	2022
Zdroj:	2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
DOI:	10.1109/itherm54085.2022.9899649
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5b5e5afed8f231ed41a8fd0e46d328f1 https://doi.org/10.1109/itherm54085.2022.9899649 Zobrazit plný text záznamu