Epoxy adhesives toughened with waste tire powder, nanoclay, and phenolic resin for metal-polymer lap-joint applications
| Autor: | Majid Sohrabian, Omid Moini Jazani, Maryam Aliakbari |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Toughness
Materials science General Chemical Engineering Organic Chemistry 02 engineering and technology Epoxy 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences Surfaces Coatings and Films Lap joint Brittleness visual_art Ultimate tensile strength Materials Chemistry Shear strength visual_art.visual_art_medium Thermal stability Adhesive Composite material 0210 nano-technology |
| Zdroj: | Progress in Organic Coatings. 136:105291 |
| ISSN: | 0300-9440 |
| DOI: | 10.1016/j.porgcoat.2019.105291 |
| Popis: | Brittleness and low thermal stability of epoxy confines its usage as adhesive for metal-polymer interfaces. In this work, epoxy formulations containing phenolic resin (X1 (wt.%), for thermal stability), recycled tire powder (X2 (wt.%), economically reasonable for toughening), and clay nanoplatelets (X3 (wt.%), for modulus enhancement) were optimized based on L9 Taguchi experimental design approach. The main effects of X1, X2, and X3 on mechanical properties of epoxy adhesives including tensile strength, Young’s modulus, and toughness, were studied by taking into account signal-to-noise ratio (S/N) as well as the analysis of variance (ANOVA). It was found that at X1 level of 50 wt.%, X2 level of 10 wt.%, and X3 level of 2 wt.% an increase of about 39% was observed in the single-lap shear strength compared to blank epoxy adhesive formulation. Scanning electron microscopy revealed crack mechanism in the form of deviation of crack growth pathway when encountered with large platy nanoclays. Thermal stability of epoxy was also improved by 16% based on degradation peak temperature monitoring. |
| Databáze: | OpenAIRE |
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