BinDev: a Metric of Geometric Accuracy for Plasma-etch 3D Modeling Using Computer Vision : YM: Yield Methodologies
| Autor: | Yutong Xie, Benyamin Davaji, Peter C. Doerschuk, Amit Lal, Ivan Chakarov, Sandy Wen, Michael Hargrove, David Fried |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). |
| DOI: | 10.1109/asmc57536.2023.10121089 |
| Databáze: | OpenAIRE |
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