Autor: |
Craig A. Cabelli, Jose M. Arias, Atul Joshi, Jagmohan Bajaj, Gary W. Hughes, Markus Loose, Lester J. Kozlowski, James D. Garnett, M. Zandian, Selmer Wong, Kadri Vural, Donald E. Cooper, Allan K. Haas, Mark Farris, Scott A. Cabelli, John T. Montroy, J. G. Pasko, A. C. Chen |
Rok vydání: |
2002 |
Předmět: |
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Zdroj: |
SPIE Proceedings. |
ISSN: |
0277-786X |
DOI: |
10.1117/12.478849 |
Popis: |
The past 2 to 3 years has been a period of explosive growth in technology development for imaging sensors at Rockwell Scientific Co. (RSC). The state of the art has been advanced significantly, resulting in a number of unique advanced imaging sensor products. A few key examples are: 2048 x 2048 sensor chip assemblies (SCA) for ground and space-based applications, 4096 x 4096 mosaic close-butted mosaic FPA assemblies, a very high performance 10 x 1024 hybridized linear SCA for optical network monitoring and other applications, the revolutionary CMOS ProCam-HD imaging system-on-a-chip for high definition television (HDTV), and RSC's near-infrared emission microscope camera for VLSI defect detection/analysis. This paper provides selected updates of these products and thereby provides an overview of the ongoing highly fertile period of technology and product development at Rockwell Scientific. A view into future directions for advanced imaging sensors is also provided. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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