FAST PLASMA DEPOSITION OF CARBON AND SILICON LAYERS

Autor: JJ Beulens, CJ Timmermans, Atm Wilbers, Thj Bisschops, Gmw Gerrit Kroesen, Ajm Buuron, GJ Gijs Meeusen, Abm Bertus Husken, L A Bisschops, DC Daan Schram
Rok vydání: 1990
Předmět:
Zdroj: Le Journal de Physique Colloques. 51:C5-361
ISSN: 0449-1947
DOI: 10.1051/jphyscol:1990543
Popis: By separating plasma production and plasma deposition and by taking advantage of the high specific ionizing power of thermal plasmas, very high deposition rates on large areas of amorphous C-H and Si-H are obtained. The layers have been analyzed by several methods, such as ellipsometry (band gap, absorption in the visible C-H, Si-H bonding types in the infrared), nuclear techniques (hydrogen depth profile), ESCA, and diffraction. The plasma is produced at high pressure (0.1-1 bar) in a cascaded arc in a carrier gas (argon). Downstream the feed gases (CH/sub 4/ and SiH/sub 4/) and additional gases (H/sub 2/) are admixed to the mainstream. Nearly complete dissociation and charge transfer from argon to Si and C takes place whereas the plasma is accelerated to sonic velocities at the high temperature (1 eV)
Databáze: OpenAIRE