The Soaking Process Optimization for the Conductive Slip-Ring
| Autor: | Li Peng Zhang, Jian Ye Gao, Kun Liang Zhang, Zhen Dong Gao, Ya Ji, Bin Hong |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Imagination
Thesaurus (information retrieval) Materials science Packaging engineering business.industry Mechanical Engineering media_common.quotation_subject Mechanical engineering Condensed Matter Physics Slip ring Search engine Mechanics of Materials General Materials Science Process optimization business Science technology and society Electrical conductor media_common |
| Zdroj: | Materials Science Forum. 943:53-57 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.943.53 |
| Popis: | Due to its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology was put forward for which includes a soaking process.By the construction of the soaking models, the packaging technology was calculated by MATLAB and discussed. The soaking model reveals that the soaking time is strongly influenced by the space of the exhaust vent and the added pressure. When the soaking pressure is set at 6 atm with the vent of 0.02 mm width, the EMC can be completely soaked into the tiny spaces of the CSR in 5 min. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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