Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Autor:	Keiji Matsumoto, Takahito Watanabe, Risa Miyazawa, Toyohiro Aoki, Takashi Hisada, Yuzo Nakamura, Yasuhisa Kayaba, Jun Kamada, Kazuo Kohmura
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5ad5575fb764c818b5d887fff5c47238 https://doi.org/10.1109/ectc51906.2022.00063 Zobrazit plný text záznamu