Autor:	Kevin Moeggenborg, Meong Keun Ju
Rok vydání:	2022
Předmět:	Mechanics of Materials Mechanical Engineering General Materials Science Condensed Matter Physics
Zdroj:	Materials Science Forum. 1062:175-179
ISSN:	1662-9752
DOI:	10.4028/p-wkn17q
Popis:	Wafer scratching from handling and processing can impact the performance of devices grown on a substrate. Knowledge of process conditions and modeling of scratches on wafers can be used to elucidate the root cause of scratches so that they can be eliminated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5aad8816c87e5fa33eb441fc5e730025 https://doi.org/10.4028/p-wkn17q Zobrazit plný text záznamu