Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process

Autor: Shinichi Endo, Tomoyuki Habu, Shintaro Yabu
Rok vydání: 2020
Zdroj: Transactions of The Japan Institute of Electronics Packaging. 13:E19-013
ISSN: 1884-8028
1883-3365
DOI: 10.5104/jiepeng.13.e19-013-1
Databáze: OpenAIRE