Study of electrical properties of alternate layers of SN100C and Tin and changes observed with aging time
| Autor: | Monalisa Char, Sumantra Das |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Intermetallic chemistry.chemical_element Solder paste 02 engineering and technology 021001 nanoscience & nanotechnology Microstructure 01 natural sciences law.invention chemistry Optical microscope Electrical resistivity and conductivity law Soldering 0103 physical sciences Service life Composite material 0210 nano-technology Tin |
| Zdroj: | Materials Today: Proceedings. 44:2926-2929 |
| ISSN: | 2214-7853 |
| Popis: | Quality and reliability of any solder joint depends on the interfacial morphology and distribution of the intermetallic compounds (IMCs) across the solder joint interface. In the present work, author shows the changes in microstructures and resistivity of the solder joints prepared with SN100C solder paste along with thin Sn film as interlayer using Cu pad as substrate. The micro-structural observations and the resistivity study of the samples with aging time were carried out by the optical microscope and 4 probe Source Measuring Unit (SMU) respectively. Result establishes the fact that the resistivity could be controlled by the addition of layers like Sn. It is also reported that the addition of Sn interlayer changes the microstructure and lowers the growth of the intermetallic compounds at the interface of the solder joint. It is concluded that, if alternate layers of Sn and solder paste (SN100C) are arranged, then the reliability and the performance of the soldered components will improve greatly and hence shall increase the service life of the gadgets. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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